Optical Packaging Engineer- Flip Chip Assembly- 2.5D Packaging If you are a Optical Packaging Engineer- Flip Chip Assembly- 2.5D Packaging with experience, please read on!
What You Will Be Doing (THIS POSITION REPORTS TO THE MILPITAS AREA OF CALIFORNIA AND REQUIRES RELOCATION, PARTIAL REMOTE ALLOWED)
The Package Engineering function provides support, expertise, and insight to the Silicon device development team through preliminary activities of package selection, routing techniques and necessary simulation work. The position involves diverse responsibilities, including evaluation of new packaging technology, package recommendation for custom devices, substrate design support, device/package qualification. You will be working very closely with Package Design/Manufacturing team in our headquarter and customers in USA. Also, you will be working very closely with Marketing and Engineering teams located in our Santa Clara office during pre/post sales process.

The Director position requires experience in the Fabless semiconductor model with a broad knowledge of package technology and manufacturing. Successful candidates will have a deep understanding of a variety of IC package technologies. Candidate should possess specific experience in the following areas: high performance build-up substrates, flip chip assembly or 2.5D packaging. Knowledge of Chiplet technology, Optical integrated packages and also experience in extracting/simulating package designs for SI and PI using tools such as HFSS, POWER SI and other leading tools.

Qualifications

Education

" Bachelors degree in Electrical Engineering, or other semiconductor packaging related discipline

Required Experience And Skills

" 10 years of experience in semiconductor packaging design and simulations
" Record of success in cross-functional team environment
" Good experience with SI/PI tools for package level extraction/simulation
" Ability to work with Package Layout engineers
" Strong presentation and communication skills

Preferred Experience And Skills

" Good knowledge of IC package materials and manufacturing
What You Need for this Position - Optical Packaging Engineer
- Flip Chip Assembly
- Optical Engineer
- 2.5D Packaging
- Packaging Engineer
- Chiplet technology
- semiconductor packaging design
- Simulations
- IC package materials
So, if you are a Optical Packaging Engineer- Flip Chip Assembly- 2.5D Packaging with experience, please apply today!
- Applicants must be authorized to work in the U.S.

*CyberCoders, Inc is proud to be an Equal Opportunity Employer*

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, disability, protected veteran status, or any other characteristic protected by law.

*Your Right to Work* - In compliance with federal law, all persons hired will be required to verify identity and eligibility to work in the United States and to complete the required employment eligibility verification document form upon hire.