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RF Package Engineer at MA-COM Technology Solutions Inc

Posted in Other 30+ days ago.

Type: Full Time
Location: LOWELL, Massachusetts





Job Description:

Company Overview:

MACOM designs and manufactures semiconductor products for Data Center, Telecommunication and Industrial and Defense applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard.

MACOM has more than 65 years of application expertise with multiple design centers, Si, GaAs and InP fabrication, manufacturing, assembly and test, and operational facilities throughout North America, Europe, and Asia. Click here to view our facilities. In addition, MACOM offers foundry services that represents a key core competency within our business.

MACOM sells and distributes products globally via a sales channel comprised of a direct field sales force, authorized sales representatives and leading industry distributors. Our sales team is trained across all of our products to give our customers insights into our entire portfolio.

MACOM is an Equal Opportunity Employer.

We consider applicants for all positions without regard to race, color, religion, creed, gender, national origin, age, disability, marital status or veteran status or any other legally protected status.

RF Package Engineer

JOB DESCRIPTION:

Member of the team responsible for RFIC package development, supporting NPI from concept through production release. The team provides direction to product and design engineers for high performance, cost effective packaging solutions. Package types include overmolded leadframe based packages, air-cavity packages, laminate packages, ceramic packages and metal packages for RF and Microwave microelectronic assemblies. We are looking for an individual that enjoys understanding and solving a variety of technical problems and challenges.

Responsibilities:

* Work with internal product design, QA, Reliability, Failure Analysis, supply chain, and the external suppliers to develop and qualify the appropriate packaging technologies and assembly processes, with focus on cost, high volume manufacturability, yield and quality

* Work with vendors and internal engineering resources to establish and update design rules for packaging

* Implement and improve robust assembly processes internally and at our contract manufacturers

* Keep up to date with latest package technologies

* Troubleshoot IC packaging defects, then define and implement solutions

* Provide supplier benchmarking and tracking data to drive backend technology roadmap

* Working with Quality organization, characterize failure modes, and analyze as a function of packaging materials and processes

* Provide application notes for new packages

Qualifications:

* BS and prior experience in RF/Microwave assemblies preferred

* Proven track record of successfully driving projects from concept to implementation.

* Good understanding of package materials and their properties

* Knowledge of high-volume RFIC and Microwave IC assembly processes (die attach, flip chip, wafer saw, wire bond, surface mount, package singulation, etc.)

* Knowledge of failure analysis methodology

* Ability to work independently under tight deadlines, with strong ownership of projects

* Good written and verbal communication skills. Able to present ideas, design concepts, data and plans with high confidence at team meetings and executive review meetings

* Solid understanding and use of statistical techniques including DOE and SPC

* Knowledge of product characterization and reliability testing standards [JEDEC, IPC, EIA, RoHS, WEEE, MIL-STD]

* Domestic and International travel required (once a quarter)

* Experience with CAD tools and finite element analysis (FEA or CFD) software is a plus

M/A-COM Technology Solutions promotes equal employment opportunity for all employees and applicants in all aspects of employment. It is our belief that strength comes from a diverse workforce. M/A-COM Technology Solutions is committed to being an Equal Opportunity Employer. The objective of M/A-COM Technology Solutions is to recruit, hire, train, and promote the most qualified applicants without regard to race, color, religion, creed, ancestry, sex, gender, sexual orientation, age, national origin, disability or handicap, genetic information, or veteran status (disabled veteran or veteran of the Vietnam Era). All such decisions are made using standards based on the individual s qualifications as they relate to the particular job opportunity, and on the goal of furthering equal employment opportunity. M/A-COM Technology Solutions prohibits unlawful discrimination against applicants, employees, customers, or vendors based on race, color, religion, ancestry, national origin, gender, age, marital status, veteran status, sexual orientation, disability, or medical condition. M/A-COM Technology Solutions also


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