*Job description

Engineers develop next-generation technologies and are pushing boundaries in self driving hardware. As a member of an extraordinarily creative, motivated and talented team, you develop new products that are used by millions of people. We need our engineers to be versatile and passionate to tackle new problems as we continue to push technology forward. If you get excited about building new things and aren't daunted by the challenge of building something from scratch, then our team might be your next career step

As a SME for (Printed Circuit Board / Printed Circuit Board Assembly), you will work from prototype to NPI to commercialization of products. You will be the cornerstone of all Printed Circuit Board Assembly activities and will work with technical cross-functional teams in the development of new products.

The position requires a strong technical aptitude including an excellent understanding of PCB/ PCBA domain knowledge in process and mfg and supplier capabilities,  DfM methodologies, high volume electronics manufacturing processes, printed circuit board technology, component selection, test and inspection methodologies, quality assurance and consumer electronics product development.

Responsibilities:

●      Perform Design for Manufacturability (DfM) analysis and deliver scalable manufacturing solutions for PCBAs

●      Support NPI builds from concept to product launch, including build preparation, build reports and issue resolution at contract manufacturers

●      Identify and drive DfM and process improvements that reduce process cycle times and cost, while maintaining exceptional quality

●      Develop new processes that enable next generation design and manufacturing capabilities at Waymo

Minimum Qualifications:

●      BS in Electrical Engineering, Industrial Engineering, Manufacturing Engineering or equivalent practical experience

●      10 years of relevant work experience with consumer or communication products with a strong background in PCBA manufacturing and hands-on process experience

●      Technologist with an extremely high level of creativity and curiosity about materials science and electronics packaging at all levels

●      Expertise in rework processes, especially rework with underfills.  Expertise in component footprint design rules and miniaturization. 

Preferred Qualifications:

●      MS in Electrical Engineering, Industrial Engineering, Manufacturing Engineering or equivalent practical experience

●      Advanced materials; underfills, thermal interface materials, RF shielding

●      Knowledge of typical PCBA and product level failure modes and ability to relate failure modes to process, material and design related stressors

●      Hardware Reliability Testing

●      Experience using tools such as Valor & Allegro

●      Familiarity with surface mount assembly of flexible circuits including best practices for material